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Huawei develops 122TB SSD with new packaging tech to sidestep US sanctions on 3D NAND chips — Chinese firm develops proprietary tech to cram more NAND dies in a smaller footprint

2026年5月23日 19:40
Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the limitations of traditional NAND packaging to deliver higher capacity using less dense 3D NAND dies.

Laser-driven spintronic memory device switches 1,000 times faster than DRAM —non-volatile device switches in 40 picoseconds while generating almost no heat

2026年5月20日 18:20
Researchers at the University of Tokyo demonstrated a non-volatile Mn₃Sn magnetic switching device capable of flipping bits in just 40 picoseconds while generating minimal heat, potentially paving the way for lower-power AI hardware and memory systems.

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