TSMC, other companies to invest $250 billion in the U.S. as part of trade deal, TSMC reportedly mulls additional $100 billion investment and four more fab modules.

Automaker BMW has filed a patent for a new fastener which takes design cues from the its iconic segmented roundel logo. but it has been accused of creating this design for service and repair gatekeeping.

Japan’s state-backed foundry Rapidus plans to begin production of 2nm-class semiconductors in the second half of its fiscal year 2027, with full-scale production expected in 2028.

“We’re easily going to get over a trillion transistors… in the package, by the end of the decade,” Cadence Senior Vice President Paul Cunningham claims.

Rising DRAM and NAND prices driven by AI megatrend and amplified by memory overbooking are hitting sales of inexpensive consumer electronics and smartphones, which affects orders of entry-level processors to foundries, according to SMIC.

Bipartisan group of lawmakers want the U.S. government to impose export controls on all wafer fab equipment bound to China except those that can be made locally and make allies do the following.

While all makers of microelectronics are set to benefit from the AI supercycle, the memory industry is projected to generate more than twice the revenue of the foundry industry.

TSMC's board of directors approves spending on new production capacities and promotes a key executive leading the development of A10 fabrication process due in 2030 or later.

Taiwan authorities have no problems with TSMC investing in the U.S. as long the bulk of its fabs and leading-edge process technologies remain in Taiwan.

After recording a $791.7 billion revenue in 2025, the semiconductor industry is on track to hit $1 trillion in sales in 2026.

After years of job cuts, Intel is about to get behind TSMC in terms of the headcount.

Tenstorrent downgrades existing and new Blackhole p150 cards from 140 to 120 tensor cores

As Nvidia is ramping up production of the Rubin platform, other 3nm-class process suffer

Glass wafer materials are emerging as a potential and viable alternative to their more conventional, aged organic counterparts.

Intel demonstrates 8X reticle size prototype system-in-package that features four logic tiles, two I/O tiles, and 12 HBM4-class stacks.

The ongoing trade war puts Taiwan and TSMC in a difficult position. As negotiations continue, the country risks giving up its most precious commodity, the might of TSMC.

Nvidia's Huang claims that Taiwan will not lose its silicon shield as TSMC expands overseas because demand for leading-edge semiconductor production is so high that a global chipmaking footprint is essential to meet it.

ASML is on track to boost its annual sales to up to $71 billion by 2030 as demand for EUV tools set records.

Samsung's Fab in Taylor, Texas, set to start trial production sometimes in the second half of 2026 with mass production slated for 2027. With pellicles finally implemented for 2nm-class flows, Samsung could finally offer consistent yields and performance.

Neurophos built a silicon photonics chip that's 10,000 smaller than current tech and could potentially deliver 10x the performance of Nivida's Vera Rubin GPUs using the same amount of power and available chip fab technologies.