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✇Tomshardware

Intel's Ohio One project shows healthy progress as new job listings pop up — construction seems to be well underway as contractor actively hiring for ambitious chip factory

Bechtel, the contractor behind Intel's ambitious Ohio One chip factory, has posted new job listings on its website with an overview mentioning Phase 1 of the project. These recruits will be responsible for accelerating construction to make the factory ready for its opening in 2030, after the last few months turned Intel's fate around.

✇Tomshardware

UK company shoots a 1,000-degree furnace into space to study off-world chip manufacturing — semiconductors made in space could be 'up to 4,000 times purer' than Earthly equivalents

British startup Space Forge has just successfully turned on its first in-orbit furnace, reaching 1,000 degrees Celsius in space. This is a crucial first step for the company in studying the feasibility of manufacturing chips in space.

✇Tomshardware

China tells chipmakers to use homegrown chipmaking tools for 50% of new capacity — decree designed to squeeze foreign suppliers out of supply chain

China has quietly mandated that at least 50% of equipment used for new semiconductor capacity be domestically sourced. However, as China's industry cannot produce enough lithography tools, authorities tend to get flexible and allow foreign alternatives in.

✇Tomshardware

TSMC chipmaking factories rocked by magnitude 7.0 earthquake that was the strongest in 27 years, but facilities escaped unharmed — company's earthquake protection measures pay off

Yesterday, the ground shook off the coast of Taiwan, slamming the country with the strongest earthquake in 27 years. The seismic wave registered 7.0 in Taiwan's scales, or 6.6 to 6.7 according to the USGS standard. Thankfully, according to reports, TSMC's factories are all intact, saving the world from yet another spike in chip prices.

✇Tomshardware

Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's biggest — floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM

Intel Foundry has released a video of a multi-chiplet 2.5D/3D processor with a 10,296 mm^2 silicon footprint, including leading-edge technologies such as 14A and 18A.

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