GlobalFoundries' acquisition of MIPS will not turn it into a chipmaker, but will enhance its role as a foundry by offering ready-to-use RISC-V processor IP to help customers accelerate development.
China has made progress in advanced chipmaking, but many ambitious fab projects failed due to lack of expertise, poor planning, and U.S. export restrictions — leaving behind numerous costly but unused 'zombie fabs' across the country.
Over 30 current and former TSMC Arizona employees have joined a class-action lawsuit accusing the company of discriminating against American workers, enabling racist behavior, and maintaining unsafe conditions at its Fab 21 facility.
LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
TSMC is reportedly slowing work on its second Japanese fab to accelerate buildout in Arizona in anticipation of possible U.S. tariffs on Taiwan-made chips, though the company maintains that its expanded American investments will not affect its projects in Japan and Germany.
The U.S. has lifted recent license requirements on exporting chip design software to China in exchange for Beijing easing rare earth export controls, enabling Cadence, Siemens, and Synopsys to resume shipments to clients in the People's Republic.
Intel CEO Lip-Bu Tan is weighing whether to stop offering the company's 18A technology to external clients and instead focus on the next-generation 14A process, a move that could withdraw Intel from the broad foundry market for several years.
Surging adoption of AI, next-generation technologies is driving semiconductor makers to expand 7nm and more advanced production capacity by 69% through 2028.
Rapidus plans to produce 2nm chip production with integrated packaging by 2027, but ex-Intel CEO Pat Gelsinger cautions that it needs unique technology to compete with TSMC.
A satellite designed to produce semiconductors in space has reached low-Earth orbit, launching on a SpaceX rideshare mission. ForgeStar-1 from Space Forge seeks to be a proof of concept to prove that fabrication in space is possible and scalable.
China's Big Fund III is refocusing on building local lithography equipment and chip design software after U.S. export bans blocked access to advanced tools, pushing managers to prioritize filling these critical gaps over supporting already strong areas.
The semiconductor industry is experiencing strong growth and soaring demand, but a worsening shortage of engineers, managers, and technical talent threatens to undermine its ability to grow further.
Taiwan's blacklisting of 601 Chinese firms, including Huawei and SMIC, over national security concerns have provoked fierce condemnation from Beijing, which threatened retaliatory measures.
Intel has once again postponed the launch of its Ohio chip plant, which is now expected in 2031, leaving utility AEP Ohio with an idle $95 million substation.
Intel has fully detailed its 18A (1.8nm-class) process at VLSI 2025, highlighting major performance, power, and density improvements enabled by RibbonFET transistors and PowerVia backside power delivery.
Fudan University researchers have allegedly developed a photonics-based multiplexer chip, supporting up to 38 Tbps data transmission. While not yet a full CPU, Chinese industry observers believe China's big breakthrough in photonics will arrive in "three to five years".
Texas Instruments follows the semiconductor industry in announcing its new investments in expanding U.S. facilities, though we already knew about most of the projects.
Imec has introduced a more manufacturable version of its forksheet transistor, named the outer wall forksheet, intended to extend gate-all-around (GAA) technology through the A10 node and serve as a stepping stone toward future CFET designs.
Two of the most important companies behind China’s semiconductor self-sufficiency and AI supremacy hopes were dealt a blow on Saturday, with their addition to Taiwan’s strategic high-tech commodities entity list.
Several major U.S. semiconductor projects — including Amkor’s packaging plant in Arizona, Micron’s $100B DRAM fab in New York, and SK hynix’s HBM site in Indiana — are facing delays or opposition due to environmental reviews and local protests.
Industry reports indicate access to some vital semiconductor design software has been restored in China, following a call between President Trump and Xi Jinping.
Inversion Semiconductor, a 2024 startup backed by Y Combinator, aims to develop a compact, LWFA-based light source that 10 times more powerful than ASML's current EUV light sources while also targeting even shorter wavelengths.
In a presentation at Bank of America's global technology conference this year, Intel Products CEO Michelle Johnston Holthaus discussed some of Intel's intense moves to get back into contention against a fierce chip industry.
Contract fab GlobalFoundries has announced a commitment to spend $16 billion on plant expansion and advanced packaging research. The move comes with no expected spending date.
The media in Taiwan have highlighted the lucrative compensation packages being used to tempt engineers to fill key roles and fuel Nvidia’s ambitious expansion plans.
TSMC is preparing to begin 2nm chip production with wafer prices reportedly reaching $30,000 and potentially $45,000 for more advanced nodes like A16, driven by the complexity of backside power delivery.
Synopsys has told staff in China to halt sales and services, and has suspended future financial guidance, following new U.S. export restrictions on semiconductor software.