Surging adoption of AI, next-generation technologies is driving semiconductor makers to expand 7nm and more advanced production capacity by 69% through 2028.
Rapidus plans to produce 2nm chip production with integrated packaging by 2027, but ex-Intel CEO Pat Gelsinger cautions that it needs unique technology to compete with TSMC.
A satellite designed to produce semiconductors in space has reached low-Earth orbit, launching on a SpaceX rideshare mission. ForgeStar-1 from Space Forge seeks to be a proof of concept to prove that fabrication in space is possible and scalable.
China's Big Fund III is refocusing on building local lithography equipment and chip design software after U.S. export bans blocked access to advanced tools, pushing managers to prioritize filling these critical gaps over supporting already strong areas.
The semiconductor industry is experiencing strong growth and soaring demand, but a worsening shortage of engineers, managers, and technical talent threatens to undermine its ability to grow further.
Taiwan's blacklisting of 601 Chinese firms, including Huawei and SMIC, over national security concerns have provoked fierce condemnation from Beijing, which threatened retaliatory measures.
Intel has once again postponed the launch of its Ohio chip plant, which is now expected in 2031, leaving utility AEP Ohio with an idle $95 million substation.
Intel has fully detailed its 18A (1.8nm-class) process at VLSI 2025, highlighting major performance, power, and density improvements enabled by RibbonFET transistors and PowerVia backside power delivery.
Fudan University researchers have allegedly developed a photonics-based multiplexer chip, supporting up to 38 Tbps data transmission. While not yet a full CPU, Chinese industry observers believe China's big breakthrough in photonics will arrive in "three to five years".
Texas Instruments follows the semiconductor industry in announcing its new investments in expanding U.S. facilities, though we already knew about most of the projects.
Imec has introduced a more manufacturable version of its forksheet transistor, named the outer wall forksheet, intended to extend gate-all-around (GAA) technology through the A10 node and serve as a stepping stone toward future CFET designs.
Two of the most important companies behind China’s semiconductor self-sufficiency and AI supremacy hopes were dealt a blow on Saturday, with their addition to Taiwan’s strategic high-tech commodities entity list.
Several major U.S. semiconductor projects — including Amkor’s packaging plant in Arizona, Micron’s $100B DRAM fab in New York, and SK hynix’s HBM site in Indiana — are facing delays or opposition due to environmental reviews and local protests.
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