Several major U.S. semiconductor projects — including Amkor’s packaging plant in Arizona, Micron’s $100B DRAM fab in New York, and SK hynix’s HBM site in Indiana — are facing delays or opposition due to environmental reviews and local protests.
Industry reports indicate access to some vital semiconductor design software has been restored in China, following a call between President Trump and Xi Jinping.
Inversion Semiconductor, a 2024 startup backed by Y Combinator, aims to develop a compact, LWFA-based light source that 10 times more powerful than ASML's current EUV light sources while also targeting even shorter wavelengths.
In a presentation at Bank of America's global technology conference this year, Intel Products CEO Michelle Johnston Holthaus discussed some of Intel's intense moves to get back into contention against a fierce chip industry.
Physicists at the UK's Loughborough University have printed the "world's smallest violin" in platinum, measuring 13 x 35 microns. The nanolithography achievement will pave the way for studying the future of nanoscale computing.
Contract fab GlobalFoundries has announced a commitment to spend $16 billion on plant expansion and advanced packaging research. The move comes with no expected spending date.
The media in Taiwan have highlighted the lucrative compensation packages being used to tempt engineers to fill key roles and fuel Nvidia’s ambitious expansion plans.
TSMC is preparing to begin 2nm chip production with wafer prices reportedly reaching $30,000 and potentially $45,000 for more advanced nodes like A16, driven by the complexity of backside power delivery.
Synopsys has told staff in China to halt sales and services, and has suspended future financial guidance, following new U.S. export restrictions on semiconductor software.
TSMC reaffirmed that it will not use High-NA EUV lithography for its upcoming A16 and A14 process technologies, as Low-NA EUV tools combined with internal innovations provide sufficient scaling and performance benefits.
AMD has acquired photonics firm Enosemi, highlighting a desire to push into photonics and to become a full software stack supplier in the datacenter, chasing Nvidia in both respects.
TSMC will open its first European chip design center in Munich to support European developers with design technology co-optimization for both mature and advanced nodes.
登录
