Nvidia has taken a $2 billion equity stake in Synopsys, as the two companies announced a long-term collaboration to accelerate electronic design automation workloads on GPUs.

AMD and HPE are expanding their long-running partnership with a new agreement that will bring the AMD Helios rack-scale AI architecture into HPE’s product portfolio from 2026.

U.S. government to inject up to $150 million in xLight, a startup developing EUV light source based on a particle accelerator, with the first CHIPS and Science Act grant by the Trump Administration.

Samsung researchers have published a detailed account of an experimental NAND architecture that aims to cut one of the technology’s largest power drains by as much as 96%.

Alchip and Ayar Labs team up to build optical connectivity solution based on TSMC's COUPE framework that lets fabless chip designers to easily add optical connectivity to their designs.

TrendForce reported on December 1 that NAND Flash wafer supply tightened sharply in November as AI workloads and enterprise SSD orders continued to drive sustained demand.

Apple is preparing to qualify Intel’s 18A process for its lowest-end M-series processor, according to a post on X from analyst Ming-Chi Kuo.

Micron is preparing a major expansion of its Hiroshima operations to build a dedicated high-bandwidth memory facility, according to a report by Nikkei Asia.

Tensions inside Nexperia have sharpened after its parent company, Wingtech Technology, publicly accused the Dutch head office of deception and obstruction.

At the ICC Global CEO Summit in Beijing, China Semiconductor Industry Association vice chairman Wei Shaojun claimed that a new domestically designed AI processor using mature 14nm logic and 18nm DRAM nodes can match the performance of Nvidia’s current 4nm chips.

Taiwanese prosecutors have searched the homes of former TSMC Senior Vice President Lo Wen-jen, days after the company filed a civil lawsuit alleging that Lo may have leaked trade secrets to Intel.

Chinese technology giants, including Alibaba and ByteDance, are increasingly training their most advanced artificial intelligence models in Southeast Asia.

A supplier power fault briefly stopped TSMC’s Fab 21 in Arizona and led to some wafer losses. But TSMC has learnt from the occurrence, says the company.

Taiwan has confirmed it will allocate over NT$100 billion — around US$3.2 billion — for a multi-year national AI infrastructure plan, to become a global leader in AI compute and hardware by 2040.

As TSMC hits a supply-side wall with CoWoS, Intel may be positioned to provide reprive with EMIB and Foveros.

TSMC initiates legal action against Wei-Jen Lo, who retired from TSMC this summer, signed a non-compete agreement, but subsequently joined Intel as Executive Vice President.

Huawei has introduced Flex:ai, an open-source orchestration tool designed to raise the utilization rate of AI chips in large-scale compute clusters.

TSMC Chairman-CEO C. C. Wei says capacity is roughly three times short of what its major customers plan to consume.

Huawei’s in-house Ascend processors and their surrounding supplier network are being positioned as the foundation of a national effort to build an independent, fully domestic semiconductor ecosystem.

Intel CEO Lip-Bu Tan dismisses speculation that former TSMC executive Wei-Jen Lo could have brought advanced TSMC process secrets to Intel.