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今天 — 2025年12月5日首页
昨天 — 2025年12月4日首页

HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027

2025年12月3日 02:30
HBM is undergoing its first major architectural overhaul in a decade, as HBM4, HBM4E, and C-HBM4E will introduce a 2048-bit interface, logic-node base dies, and optional custom memory logic inside base dies, enabling up to a 2.5X performance leap between 2025 and 2027.

昨天以前首页

The RAM pricing crisis has only just started, Team Group GM warns — says problem will get worse in 2026 as DRAM and NAND prices double in one month

2025年12月1日 23:36
The diversion of DRAM capacity into HBM for AI has already doubled memory prices, pushed DDR5 above $27 per 16 Gb, and, according to Gerry Chen of TeamGroup, will leave the market short through at least 2027–2028 as new fabs come too late to relieve supply.

Framework stops selling standalone RAM to ward off scalpers — warns it will have to increase memory pricing soon as AI crunch bites

2025年11月25日 20:59
The memory crisis has hit Framework, the company behind highly customizable laptops that users can upgrade on their own. Framework sells SO-DIMM modules on its website that are now all out of stock, with only two DDR4 models still remaining. These can be purchased separately, while the company still has some DDR5 inventory left that it'll be bundling with its DIY Edition laptops.

Micron says New York chipmaking fabs still on track according to its latest timelines — accelerates second fab in Idaho and reallocates CHIPS Act funding (Updated)

2025年11月10日 20:56
Micron’s latest Environmental Impact Statement confirms that its New York DRAM fab complex remains on schedule, with Fab 1 construction beginning in late 2026 and production expected around 2030, even as the company reallocates part of its CHIPS Act funding to accelerate its Idaho facilities in a broader U.S. manufacturing realignment.

SK hynix reveals DRAM development roadmap through 2031 — DDR6, GDDR8, LPDDR6, and 3D DRAM incoming

2025年11月5日 21:20
SK hynix’s DRAM roadmap presented at the SK AI Summit 2025 outlines the company’s AI-focused memory strategy through 2031 that includes DDR6, LPDDR6, GDDR8, and next generations of HBM solutions. HBF is not expected to hit the market before 2030.

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