HBM is undergoing its first major architectural overhaul in a decade, as HBM4, HBM4E, and C-HBM4E will introduce a 2048-bit interface, logic-node base dies, and optional custom memory logic inside base dies, enabling up to a 2.5X performance leap between 2025 and 2027.
The diversion of DRAM capacity into HBM for AI has already doubled memory prices, pushed DDR5 above $27 per 16 Gb, and, according to Gerry Chen of TeamGroup, will leave the market short through at least 2027–2028 as new fabs come too late to relieve supply.
The memory crisis has hit Framework, the company behind highly customizable laptops that users can upgrade on their own. Framework sells SO-DIMM modules on its website that are now all out of stock, with only two DDR4 models still remaining. These can be purchased separately, while the company still has some DDR5 inventory left that it'll be bundling with its DIY Edition laptops.
Lenovo is preparing for the RAM pricing apocalypse and has already stockpiled loads of DRAM memory for its products. The company has so much inventory, in fact, that it has enough memory to last all through 2026.
If you've been eyeying a memory upgrade, forget about it. You can literally get an entire console for the price of a high-end 64 GB DDR5 kit, and the best part is that experts speculate this inflated pricing to only go up in the coming months.
A worsening commodity DRAM shortage could be amplified by Nvidia's huge LPDDR5X demand and push memory prices even higher as server RDIMMs are poised to get 2X more expensive in 2026, according to Counterpoint Research.
Micron’s latest Environmental Impact Statement confirms that its New York DRAM fab complex remains on schedule, with Fab 1 construction beginning in late 2026 and production expected around 2030, even as the company reallocates part of its CHIPS Act funding to accelerate its Idaho facilities in a broader U.S. manufacturing realignment.
SK hynix’s DRAM roadmap presented at the SK AI Summit 2025 outlines the company’s AI-focused memory strategy through 2031 that includes DDR6, LPDDR6, GDDR8, and next generations of HBM solutions. HBF is not expected to hit the market before 2030.