Multiple makers of enthusiast-grade DRAM modules showcased CAMM2 memory at Computex 2025, but there are doubts about its adoption due to uncertain motherboard support and trade-offs compared to traditional DIMMs.
Samsung plans to adopt hybrid bonding for HBM4 to improve thermal and interface performance, potentially gaining a competitive edge over SK hynix, which may delay its use due to costs concerns.
NEO Semiconductor has announced progress on its new 3D X-DRAM technology, with new 1T1C and 3T0C chip designs increasing DRAM speeds by an order of magnitude for tomorrow’s top-end computing.