NVIDIA’s N1X SoC has surfaced in FurMark, revealing RTX 2060-tier performance despite packing 6,144 CUDA cores—more than an RTX 5070. Running under Windows 11 with new 590.22 drivers, the chip appears to be in validation.
A new U.S.–EU trade deal exempts semiconductor equipment from tariffs, avoiding steep cost hikes for American chipmakers and protecting the competitiveness of U.S. fabs.
Intel admits that it may halt or cancel development of its 14A (1.4nm-class) process node — its first to use High-NA EUV — if it fails to secure a major external customer or meet key milestones, which would likely mean its exit from the leading-edge semiconductor race.
Nvidia and MediaTek have allegedly delayed the N1X AI PC platform to early 2026, possibly because of Microsoft’s next-gen OS delays, ongoing Nvidia chip revisions, and weakening consumer notebook demand. The launch will now prioritize enterprise PCs, while GB10-based AI workstations are expected to debut much sooner.
Synopsys has received final approval from China to acquire Ansys for $35 billion, creating a powerful end-to-end design platform spanning semiconductor design and system simulation, but raising competitive and geopolitical concerns.
GlobalFoundries' acquisition of MIPS will not turn it into a chipmaker, but will enhance its role as a foundry by offering ready-to-use RISC-V processor IP to help customers accelerate development.
China has made progress in advanced chipmaking, but many ambitious fab projects failed due to lack of expertise, poor planning, and U.S. export restrictions — leaving behind numerous costly but unused 'zombie fabs' across the country.
Over 30 current and former TSMC Arizona employees have joined a class-action lawsuit accusing the company of discriminating against American workers, enabling racist behavior, and maintaining unsafe conditions at its Fab 21 facility.
LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
TSMC is reportedly slowing work on its second Japanese fab to accelerate buildout in Arizona in anticipation of possible U.S. tariffs on Taiwan-made chips, though the company maintains that its expanded American investments will not affect its projects in Japan and Germany.
The U.S. has lifted recent license requirements on exporting chip design software to China in exchange for Beijing easing rare earth export controls, enabling Cadence, Siemens, and Synopsys to resume shipments to clients in the People's Republic.
Intel CEO Lip-Bu Tan is weighing whether to stop offering the company's 18A technology to external clients and instead focus on the next-generation 14A process, a move that could withdraw Intel from the broad foundry market for several years.
Surging adoption of AI, next-generation technologies is driving semiconductor makers to expand 7nm and more advanced production capacity by 69% through 2028.
Rapidus plans to produce 2nm chip production with integrated packaging by 2027, but ex-Intel CEO Pat Gelsinger cautions that it needs unique technology to compete with TSMC.
A satellite designed to produce semiconductors in space has reached low-Earth orbit, launching on a SpaceX rideshare mission. ForgeStar-1 from Space Forge seeks to be a proof of concept to prove that fabrication in space is possible and scalable.
China's Big Fund III is refocusing on building local lithography equipment and chip design software after U.S. export bans blocked access to advanced tools, pushing managers to prioritize filling these critical gaps over supporting already strong areas.
The semiconductor industry is experiencing strong growth and soaring demand, but a worsening shortage of engineers, managers, and technical talent threatens to undermine its ability to grow further.
Taiwan's blacklisting of 601 Chinese firms, including Huawei and SMIC, over national security concerns have provoked fierce condemnation from Beijing, which threatened retaliatory measures.
Intel has once again postponed the launch of its Ohio chip plant, which is now expected in 2031, leaving utility AEP Ohio with an idle $95 million substation.
Intel has fully detailed its 18A (1.8nm-class) process at VLSI 2025, highlighting major performance, power, and density improvements enabled by RibbonFET transistors and PowerVia backside power delivery.
Fudan University researchers have allegedly developed a photonics-based multiplexer chip, supporting up to 38 Tbps data transmission. While not yet a full CPU, Chinese industry observers believe China's big breakthrough in photonics will arrive in "three to five years".
Texas Instruments follows the semiconductor industry in announcing its new investments in expanding U.S. facilities, though we already knew about most of the projects.
Imec has introduced a more manufacturable version of its forksheet transistor, named the outer wall forksheet, intended to extend gate-all-around (GAA) technology through the A10 node and serve as a stepping stone toward future CFET designs.
Two of the most important companies behind China’s semiconductor self-sufficiency and AI supremacy hopes were dealt a blow on Saturday, with their addition to Taiwan’s strategic high-tech commodities entity list.
Several major U.S. semiconductor projects — including Amkor’s packaging plant in Arizona, Micron’s $100B DRAM fab in New York, and SK hynix’s HBM site in Indiana — are facing delays or opposition due to environmental reviews and local protests.