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昨天 — 2025年6月24日首页
✇Tomshardware

Intel details 18A process technology — takes on TSMC 2nm with 30% density gain and 25% faster generational performance

作者 ashilov@gmail.com (Anton Shilov)
2025年6月23日 17:59
Intel has fully detailed its 18A (1.8nm-class) process at VLSI 2025, highlighting major performance, power, and density improvements enabled by RibbonFET transistors and PowerVia backside power delivery.

© Intel

昨天以前首页
✇Tomshardware

Texas Instruments commits $60 billion to U.S. semiconductor manufacturing — includes planned expansions to Texas, Utah fabs

2025年6月19日 01:00
Texas Instruments follows the semiconductor industry in announcing its new investments in expanding U.S. facilities, though we already knew about most of the projects.

© Shutterstock

✇Tomshardware

Imec's next-gen high-speed chip transistor addresses manufacturing concerns — outer wall forksheet design simplifies production, but may sacrifice density

作者 ashilov@gmail.com (Anton Shilov)
2025年6月18日 23:46
Imec has introduced a more manufacturable version of its forksheet transistor, named the outer wall forksheet, intended to extend gate-all-around (GAA) technology through the A10 node and serve as a stepping stone toward future CFET designs.

© Intel

✇Tomshardware

Taiwan bans chip exports to Huawei, SMIC — ban comes after Huawei tricked TSMC into making two million AI processors despite US restrictions

2025年6月16日 00:06
Two of the most important companies behind China’s semiconductor self-sufficiency and AI supremacy hopes were dealt a blow on Saturday, with their addition to Taiwan’s strategic high-tech commodities entity list.

© SMIC

✇Tomshardware

CHIPS Act beneficiaries 'mired in NIMBY fights and two-year permits' — delays to Micron, Amkor, and SK hynix NY fabs costing $5M per day

作者 ashilov@gmail.com (Anton Shilov)
2025年6月11日 21:14
Several major U.S. semiconductor projects — including Amkor’s packaging plant in Arizona, Micron’s $100B DRAM fab in New York, and SK hynix’s HBM site in Indiana — are facing delays or opposition due to environmental reviews and local protests.

© TSMC

✇Tomshardware

Intel draws a line in the sand to boost gross margins — new products must deliver 50% gross profit to get the green light

2025年6月5日 22:59
In a presentation at Bank of America's global technology conference this year, Intel Products CEO Michelle Johnston Holthaus discussed some of Intel's intense moves to get back into contention against a fierce chip industry.

© Intel

✇Tomshardware

Scientists print 'world's smallest violin' in platinum with nanolithography — UK physicists push toward nanoscale computing

2025年6月5日 19:13
Physicists at the UK's Loughborough University have printed the "world's smallest violin" in platinum, measuring 13 x 35 microns. The nanolithography achievement will pave the way for studying the future of nanoscale computing.

© Loughborough University

✇Tomshardware

GlobalFoundries announces $16 billion U.S. chip production spend — striking spending boom follows demand from domestic customers

2025年6月5日 00:36
Contract fab GlobalFoundries has announced a commitment to spend $16 billion on plant expansion and advanced packaging research. The move comes with no expected spending date.

© Shutterstock

✇Tomshardware

Nvidia accused of poaching TSMC engineers in Taiwan – up to $180,000 salaries offered for talent

2025年6月4日 20:23
The media in Taiwan have highlighted the lucrative compensation packages being used to tempt engineers to fill key roles and fuel Nvidia’s ambitious expansion plans.

© Future

✇Tomshardware

TSMC could charge up to $45,000 for 1.6nm wafers — rumors allege a 50% increase in pricing over prior-gen wafers

作者 ashilov@gmail.com (Anton Shilov)
2025年6月4日 18:34
TSMC is preparing to begin 2nm chip production with wafer prices reportedly reaching $30,000 and potentially $45,000 for more advanced nodes like A16, driven by the complexity of backside power delivery.

© TSMC

✇Tomshardware

TSMC reiterates it doesn't need High-NA EUV for 1.4nm-class process technology

作者 ashilov@gmail.com (Anton Shilov)
2025年5月29日 04:27
TSMC reaffirmed that it will not use High-NA EUV lithography for its upcoming A16 and A14 process technologies, as Low-NA EUV tools combined with internal innovations provide sufficient scaling and performance benefits.

© ASML

✇Tomshardware

AMD acquires Enosemi to enter photonics race — chasing Nvidia into light-based interconnect tech

2025年5月29日 02:44
AMD has acquired photonics firm Enosemi, highlighting a desire to push into photonics and to become a full software stack supplier in the datacenter, chasing Nvidia in both respects.

© AMD

✇Tomshardware

TSMC to open up chip design center in Munich to help local chip developers

作者 ashilov@gmail.com (Anton Shilov)
2025年5月28日 23:09
TSMC will open its first European chip design center in Munich to support European developers with design technology co-optimization for both mature and advanced nodes.

© Taiwan Semiconductor Manufacturing Co., Ltd.

✇Tomshardware

AI chip boom sparks BT substrate materials shortage — TSMC's huge demand causes supply disruptions for NAND flash controllers, SSDs

2025年5月28日 03:36
TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market to react quickly to avoid shortages and other negative effects.

© Shutterstock

✇Tomshardware

Intel says foundry business won't break even until 14A in 2027

作者 ashilov@gmail.com (Anton Shilov)
2025年5月15日 01:26
Intel expects its loss-making Foundry division to reach breakeven by 2027, driven by internal adoption of its 18A process, and contributions from packaging, and mature nodes.

© Tom's Hardware

✇Tomshardware

China's premier chipmaker SMIC faces chip yield woes as equipment maintenance and validation efforts stall

作者 ashilov@gmail.com (Anton Shilov)
2025年5月10日 00:57
SMIC has begun to feel the effects of U.S. export controls on chipmaking tools, as disruptions from issues with maintenance and equipment installation led to yield losses and output shortfalls that will reduce its Q2 revenue by up to 6%.

© SMIC

✇Tomshardware

Former SK hynix employee transferred advanced chip packaging technologies to Huawei

作者 ashilov@gmail.com (Anton Shilov)
2025年5月9日 00:43
A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at Huawei’s HiSilicon, raising alarm over tech IP leaks to China.

© Amedac

✇Tomshardware

Apple expects to source over 19 billion chips from U.S. factories this year

作者 ashilov@gmail.com (Anton Shilov)
2025年5月3日 00:40
Apple plans to source over 19 billion chips from U.S. facilities in 2025 — including tens of millions from TSMC’s Arizona fab — while investing $500 billion to expand its American operations.

© Arm

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