U.S. sanctions designed to restrict China's ability to import technologies to advance of its AI and military capabilities have been strengthened for the third time.
A leader in piezoMEMS technology has announced the first active cooling fan-on-a-chip for use in smartphones, tablets, and other ultraportable devices.
Researchers have detailed a new X-ray technique that can see inside computer chips to reveal crisp and clear 3D images. Unlike prior practical investigative methods, this one is non-destructive.
The Princeton Plasma Physics Laboratory is working on how it can induce defects on TMDs and create materials with the desired electrical properties that will replace silicon for our chips.
Korean researchers have developed a method to grow sub-nanometer semiconductor logic circuits. The team from the Institute for Basic Science (IBS) claims that they grew 1D metallic materials with a width of less than 1nm and developed them into 2D circuits.
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