Intel admits that it may halt or cancel development of its 14A (1.4nm-class) process node — its first to use High-NA EUV — if it fails to secure a major external customer or meet key milestones, which would likely mean its exit from the leading-edge semiconductor race.
Nvidia and MediaTek have allegedly delayed the N1X AI PC platform to early 2026, possibly because of Microsoft’s next-gen OS delays, ongoing Nvidia chip revisions, and weakening consumer notebook demand. The launch will now prioritize enterprise PCs, while GB10-based AI workstations are expected to debut much sooner.
Synopsys has received final approval from China to acquire Ansys for $35 billion, creating a powerful end-to-end design platform spanning semiconductor design and system simulation, but raising competitive and geopolitical concerns.
GlobalFoundries' acquisition of MIPS will not turn it into a chipmaker, but will enhance its role as a foundry by offering ready-to-use RISC-V processor IP to help customers accelerate development.
China has made progress in advanced chipmaking, but many ambitious fab projects failed due to lack of expertise, poor planning, and U.S. export restrictions — leaving behind numerous costly but unused 'zombie fabs' across the country.
Over 30 current and former TSMC Arizona employees have joined a class-action lawsuit accusing the company of discriminating against American workers, enabling racist behavior, and maintaining unsafe conditions at its Fab 21 facility.
LG Innotek introduced Copper Post packaging technology, which replaces traditional solder balls in semiconductor substrates, enabling slimmer, denser, and cooler smartphone designs.
TSMC is reportedly slowing work on its second Japanese fab to accelerate buildout in Arizona in anticipation of possible U.S. tariffs on Taiwan-made chips, though the company maintains that its expanded American investments will not affect its projects in Japan and Germany.
The U.S. has lifted recent license requirements on exporting chip design software to China in exchange for Beijing easing rare earth export controls, enabling Cadence, Siemens, and Synopsys to resume shipments to clients in the People's Republic.
Intel CEO Lip-Bu Tan is weighing whether to stop offering the company's 18A technology to external clients and instead focus on the next-generation 14A process, a move that could withdraw Intel from the broad foundry market for several years.
Surging adoption of AI, next-generation technologies is driving semiconductor makers to expand 7nm and more advanced production capacity by 69% through 2028.
Rapidus plans to produce 2nm chip production with integrated packaging by 2027, but ex-Intel CEO Pat Gelsinger cautions that it needs unique technology to compete with TSMC.
A satellite designed to produce semiconductors in space has reached low-Earth orbit, launching on a SpaceX rideshare mission. ForgeStar-1 from Space Forge seeks to be a proof of concept to prove that fabrication in space is possible and scalable.
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