Fudan University researchers have allegedly developed a photonics-based multiplexer chip, supporting up to 38 Tbps data transmission. While not yet a full CPU, Chinese industry observers believe China's big breakthrough in photonics will arrive in "three to five years".
Texas Instruments follows the semiconductor industry in announcing its new investments in expanding U.S. facilities, though we already knew about most of the projects.
Imec has introduced a more manufacturable version of its forksheet transistor, named the outer wall forksheet, intended to extend gate-all-around (GAA) technology through the A10 node and serve as a stepping stone toward future CFET designs.
Two of the most important companies behind China’s semiconductor self-sufficiency and AI supremacy hopes were dealt a blow on Saturday, with their addition to Taiwan’s strategic high-tech commodities entity list.
Several major U.S. semiconductor projects — including Amkor’s packaging plant in Arizona, Micron’s $100B DRAM fab in New York, and SK hynix’s HBM site in Indiana — are facing delays or opposition due to environmental reviews and local protests.
Industry reports indicate access to some vital semiconductor design software has been restored in China, following a call between President Trump and Xi Jinping.
Inversion Semiconductor, a 2024 startup backed by Y Combinator, aims to develop a compact, LWFA-based light source that 10 times more powerful than ASML's current EUV light sources while also targeting even shorter wavelengths.
In a presentation at Bank of America's global technology conference this year, Intel Products CEO Michelle Johnston Holthaus discussed some of Intel's intense moves to get back into contention against a fierce chip industry.
Physicists at the UK's Loughborough University have printed the "world's smallest violin" in platinum, measuring 13 x 35 microns. The nanolithography achievement will pave the way for studying the future of nanoscale computing.
Contract fab GlobalFoundries has announced a commitment to spend $16 billion on plant expansion and advanced packaging research. The move comes with no expected spending date.
The media in Taiwan have highlighted the lucrative compensation packages being used to tempt engineers to fill key roles and fuel Nvidia’s ambitious expansion plans.
TSMC is preparing to begin 2nm chip production with wafer prices reportedly reaching $30,000 and potentially $45,000 for more advanced nodes like A16, driven by the complexity of backside power delivery.
Synopsys has told staff in China to halt sales and services, and has suspended future financial guidance, following new U.S. export restrictions on semiconductor software.
TSMC reaffirmed that it will not use High-NA EUV lithography for its upcoming A16 and A14 process technologies, as Low-NA EUV tools combined with internal innovations provide sufficient scaling and performance benefits.
AMD has acquired photonics firm Enosemi, highlighting a desire to push into photonics and to become a full software stack supplier in the datacenter, chasing Nvidia in both respects.
TSMC will open its first European chip design center in Munich to support European developers with design technology co-optimization for both mature and advanced nodes.
TSMC's demand for CoWoS material has cascaded to impact suppliers of BT substrate base materials, causing the memory market to react quickly to avoid shortages and other negative effects.
Intel expects its loss-making Foundry division to reach breakeven by 2027, driven by internal adoption of its 18A process, and contributions from packaging, and mature nodes.
Space Forge has secured record Series A funding that will fuel the launch of manufacturing satellites that can make materials impossible to produce on Earth.
SMIC has begun to feel the effects of U.S. export controls on chipmaking tools, as disruptions from issues with maintenance and equipment installation led to yield losses and output shortfalls that will reduce its Q2 revenue by up to 6%.
A former SK Hynix employee has been charged with stealing wafer bonding and image sensor technologies to secure a job at Huawei’s HiSilicon, raising alarm over tech IP leaks to China.
Apple plans to source over 19 billion chips from U.S. facilities in 2025 — including tens of millions from TSMC’s Arizona fab — while investing $500 billion to expand its American operations.
TSMC is evolving its strategy by developing distinct leading-edge process technologies optimized for AI, client, and HPC applications, while maintaining aggressive scaling with innovations like backside power delivery and second-generation nanosheet transistors.
Taiwan is set to enforce strict controls on outbound semiconductor investments and advanced process technology exports under the amended Industrial Innovation Act, but uncertainty remains over how the government will define and restrict its future flagship nodes.
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