Apple plans to source over 19 billion chips from U.S. facilities in 2025 — including tens of millions from TSMC’s Arizona fab — while investing $500 billion to expand its American operations.

© Arm

TSMC is evolving its strategy by developing distinct leading-edge process technologies optimized for AI, client, and HPC applications, while maintaining aggressive scaling with innovations like backside power delivery and second-generation nanosheet transistors.

© TSMC

TSMC breaks ground for its third Fab 21 module in the U.S., which will produce chips on A16 and N2 process technologies towards the end of the decade.

© TSMC

Taiwan is set to enforce strict controls on outbound semiconductor investments and advanced process technology exports under the amended Industrial Innovation Act, but uncertainty remains over how the government will define and restrict its future flagship nodes.

© TSMC

Chinese authorities might be putting an exemption from their 125% tariff on some American chip imports.

© Shutterstock

Atum Works claims its nanoscale 3D printing technology can cut chip production costs by 90% by replacing traditional production steps with direct 3D structuring, though its 100 nm resolution limits it to applications that do not need ultra-small features.

© Atum Works

TSMC is prepping a 9.5-reticle, 7,885 mm² multi-chiplet packages on 120×150 mm substrates with integrated power management for future AI and HPC processors.

© TSMC

It now employs 44,000 people and raked in nearly $31B last year.

© ASML on LinkedIn

As TSMC's capacities are fully booked through late 2027, its customers asked for more capacity in the U.S., says C.C. Wei.

© TSMC

The fate of the Tiny Tapeout TT08 and TT09 chip production projects is now unclear, as production enabler Efabless has shut down.

© Tiny Tapeout