登录China's CXMT begins producing DDR5 memory — first China-made DDR5 sticks reportedly aimed at consumer PCs
China-based CXMT has reportedly started to mass produce DDR5 memory and ship it to third-party module makers.
© CXMT
© Marvell
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Marvell develops custom HBM memory solutions — interface shrinks and higher performance on the menu
Marvell teams up with leading DRAM makers for customizable HBM solutions aimed at custom XPUs tailored for specific performance, power, and total cost of ownership
Corsair teases DDR5-10000 CUDIMMs ahead of early November release
Corsair 'pre-announces' DDR5-10000 CUDIMMs that will be available shortly.
© Corsair
Rambus announces HBM4 memory controller for AI GPUs — controller enables up to of 2.56 TB/s per HBM4 memory stack across a 2048-bit memory bus
Rambus's HBM4 controller has a lot of performance headroom, but will it ever be used?
© AMD
SK hynix develops 6th-gen 10nm-class DDR5 with the world's first 16Gb DRAM modules — chipmaker claims electric savings of up to 30% for data centers
SK Hynix has announced its 6th-generation DDR5 DRAM ICs on its 10 nm process node. The new modules are 11% faster and 9% more energy efficient than their predecessors.
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Samsung to tape out first HBM4 devices later this year, sampling begins in 2025: Report
Samsung's HBM4 details leak: 10nm for DRAMs and 4nm for base dies.
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SK hynix could get nearly $1 billion to support $3.87 billion advanced packaging facility in the U.S.
SK hynix to get massive support from U.S. government to assemble HBM4 in the U.S.
© SK Hynix
Chinese companies are stockpiling HBM2E chips ahead of new U.S. export rules
Baidu, Huawei, and Tencent are stockpiling Samsung's HBM2E memory to use with their own AI processors.
© AMD
Samsung mass produces 'world's thinnest' LPDDR5X
Samsung's new LPDDR5X uses 12nm technology to free up space in mobile devices.
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