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昨天 — 2026年1月23日首页
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Cooler Master introduces the Aquagate MAX Retro Mini cooling unit — delivers massive cooling capacity up to 2,500 watts

2026年1月9日 01:07
Cooler Master showed off a desktop coolant distribution unit at CES 2026. This unit is designed to deliver 900 to 2,500 watts of cooling performance, letting users maximize the power of high-performance desktop systems.

Plasma-powered solid-state laptop cooler to debut at CES — new cooler design uses ionized gas and electrical discharge to generate airflow

2026年1月3日 21:00
YPlasma has developed a new solid-state cooling solution that uses corona discharge to generate airflow without any moving parts. The new cooler will be on display at CES 2026 and will be presented with a live demo.

ASRock to enter AIO liquid cooling market with an intriguing pumpless design at CES — full lineup to include more traditional options, some with LCD displays

2026年1月1日 19:00
ASRock, usually known for producing motherboards, is set to debut its own AIOs at CES 2026, including flagship models featuring LCD screens. It's unclear if ASRock is licensing Asetek's pump designs, and whether it will compete against affordable brands like Thermalright.

Thermaltake's new AIO cooler uses Dall-E 3 to generate custom backgrounds for $0.04 per prompt, requires paid OpenAI subscription — "AI Forge" feature taps into OpenAI's platform and JiMeng

2025年12月29日 19:40
AI has run havoc through the entire industry and as we suffer the drying inventories of RAM and storage, we might as well see what it's all going to, right? Well, some of it is being used to generate custom backgrounds for Thermaltake's "AI Forge" feature present on its latest MagFloe AIOs and screens, which uses Dall-E and/or JiMeng.

The data center cooling state of play (2025) — Liquid cooling is on the rise, thermal density demands skyrocket in AI data centers, and TSMC leads with direct-to-silicon solutions

2025年12月16日 19:00
The rise of AI and hyperscale computing is driving a global shift from air-based to liquid and embedded cooling as various companies are developing silicon-integrated systems capable of handling multi-kilowatt system-in-packages that can be commercialized by 2027.

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