The latest Steam Hardware Survey is out and it's showing positive signs of growth for AMD, while Intel is unfortunately on a decline. The Red Team posted its best-ever CPU market share numbers in May 2026 with 45% of all CPUs on Windows being from AMD, while Intel is down to 55%, which is still more for now.
Intel introduces two new Raptor Lake CPUs in its Core 200H series lineup featuring disabled integrated graphics chips. The new CPUs are likely geared towards SFF desktops rather than laptops and 2-in-1 devices.
Intel's Wildcat Lake refresh that's supposedly debuting next year will shift focus to a more upmarket audience, only refreshing its Core 5 and Core 7 tiers. The new silicon at the top-end would feature 8 cores, up from 6 cores on Wildcat Lake right now, with the 4 P-cores and 4 LP-E cores. The Core 3 parts are claimed to remain unchanged.
Qualcomm has Snapdragon C to compete in the exciting low-cost laptop market, but it's also looking to build an entire agentic AI ecosystem on Qualcomm silicon.
Intel has unveiled the Xeon 6377P, a 12-core Bartlett Lake server processor featuring a 5.7 GHz boost clock, ECC support, and a 95W TDP. The unusual Xeon targets entry-level enterprise workloads where single-threaded performance matters more than massive core counts.
Intel knows that Arrow Lake dealt a blow to its reputation among enthusiasts. Arrow Lake Refresh was an effort to correct that issue, laying the groundwork for Nova Lake later this year.
Intel is still on schedule to at least announce Nova Lake at the end of the year, even if all rumors say the timelines have moved to next year. Apparently, the lowest-end 6-core Nova Lake mobile part targeted at budget markets won't be a part of that launch as the company is prioritizing Wildcat Lake for this segment.
AMD says that six-core X3D chips don't make sense for a broad market for a number of reasons, but a six-core X3D chip with the Zen 5 architecture is something the company is considering.
AMD just reintroduced the Ryzen 7 5800X3D, but it wasn't as simple as spinning up the old manufacturing process, as the original bonding method TSMC used was no longer available.