9to5Mac
April 22, 2022
Samsung Electro-Mechanics is collaborating with Apple on creating the M2 chip, beating out LG Innotek. Samsung is developing the flip chip ball grid array (FC-BGA) for the new generation of Apple Silicon for 2022.
The post Apple’s M2 chip nears as Samsung beats LG as processor packaging partner appeared first on 9to5Mac.
固定链接 'Apple’s M2 chip nears as Samsung beats LG as processor packaging partner' 提交: April 21, 2022, 6:48am CST 由 Allison McDaniel