阅读疯子 ydfz.cn » Tomshardware » Chipmaking to go subzero — 3D flash memory manufactured at -70C with next-gen tool
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Tomshardware
May 07, 2024
SK Hynix reportedly says 3D NAND chipmaking goes subzero as higher flash memory stacks must be produced at -70C temps.
固定链接 ' Chipmaking to go subzero — 3D flash memory manufactured at -70C with next-gen tool '
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May
6
, 2024, 7:18am CST
← Chipmaking to go subzero — 3D flash memory manufactured at -70C with next-gen tool
Explosive HBM demand fueling an expected 20% increase in DDR5 memory pricing — demand for AI GPUs drives production cuts for standard PC memory →
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