Tomshardware April 27, 2024
TSMC plans to integrate HBM4 with system-on-wafer designs in 2027. 固定链接 ' TSMC to go 3D with wafer-sized processors — CoW-SoW technology allows 3D stacking for the world's largest chips ' 提交: April 26, 2024, 2:41am CST
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