阅读疯子 ydfz.cn » Tomshardware » SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana — for HBM and other exotic memory types
首页
刷新
搜索
管理
展开/收起
Tomshardware
March 27, 2024
SK hynix plans to build a $4 billion chip packaging facility in Indiana, which could begin operations in 2029, according to a WSJ report. If the plant gets the green light, likely with tax incentives, it would focus on advanced packaging like that used for HBM3e and future HBM solutions.
固定链接 ' SK hynix reportedly planning for a $4 billion chip packaging facility in Indiana — for HBM and other exotic memory types '
提交:
March
27
, 2024, 12:49pm CST
← Microsoft's newly-unified Windows and Surface Team gets a new head — restructuring and AI in Redmond
Diablo IV's new ray tracing update is live — Outpost: Infinity Siege also gets DLSS 3 →
未登陆
登录