Tomshardware
May 22, 2023
Research giant imec showed various 3d-printed liquid cooling prototypes for processors, thus allowing the chips to break the cooling barriers associated with higher power consumption.
固定链接 ' 3D-Printed Bare-Die Liquid Chip Coolers Smash Barriers, up to 3.5X Improvement ' 提交: May 21, 2023, 7:33am CST
Research giant imec showed various 3d-printed liquid cooling prototypes for processors, thus allowing the chips to break the cooling barriers associated with higher power consumption.
固定链接 ' 3D-Printed Bare-Die Liquid Chip Coolers Smash Barriers, up to 3.5X Improvement ' 提交: May 21, 2023, 7:33am CST