The UALink Consortium has finalized the UALink 1.0 specification, enabling tapeouts of chips that support a high-speed, low-latency, industry-standard interconnect for AI and HPC accelerators in rack scale solutions.
The UALink Consortium has finalized the UALink 1.0 specification, enabling tapeouts of chips that support a high-speed, low-latency, industry-standard interconnect for AI and HPC accelerators in rack scale solutions.