Interesting tidbits regarding Apple-designed ‘A9’ chip said to power the upcoming ‘iPhone 6s’ and ‘iPhone 6s Plus’ handsets surfaced Monday, offering some previously unknown details regarding its performance and design.
It appears that the next iPhone and iPad’s processor could employ so-called system-in-package (SiP) design which squeezes some additional components into a tiny chip, including the baseband modem and the power management circuitry.
Moreover, a leaked benchmark purports to compare single and multi-thread performance of several unreleased mobile processors, such as NVIDIA’s Denver 2, Samsung’s Exynos M1, Huawei’s Kirin 950, LG’s NUCLUN 2 and Apple’s A9 and A9X.... Read the rest of this post here
"New purported details about next iPhone and iPad’s ‘A9’ chip emerge" is an article by iDownloadBlog.com.
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